43 kr.
Description
- Thermal properties, strong adhesion..
- Melting capacity: 0 (200degree celsius/ 24Hours).
- Evaporation: 0.001% (200 degree celsius/ 24Hours).
- Thermal conductivity: > 1.2W/m-K Thermal.
- Impedance:> 0.06.
Reviews
(5g) Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue For PC GPU IC
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